Specifications

ManualsBrandsAsus ManualsComputer equipment701SD Eee PC Celeron

Service overview

1-1

Service Overview

Carefully read through this chapter for a look at various components of

the Eee PC 4G (701) and necessary cautions and tools before performing

any service and repairs.

o provide the best service and support for the ASUS Eee PC 4G (701), we have

provided the below information for technicians from distributors and resellers to

perform the complete disassembly and assembly. But before performing the procedures,

please be sure to read through the overview in this chapter for component overview,

cautions and tools to avoid any unwarranted damages to the hardware.

The following chapter includes:

• Eee PC 4G (701) Overview

• Components

• Precautions

• Appropriate Tools

Chapter

Summary of content (103 pages)

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Service overview 1 Chapter Service Overview Carefully read through this chapter for a look at various components of the Eee PC 4G (701) and necessary cautions and tools before performing any service and repairs. T o provide the best service and support for the ASUS Eee PC 4G (701), we have provided the below information for technicians from distributors and resellers to perform the complete disassembly and assembly.
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Service overview Eee PC 4G (701) Overview and Components The ASUS Eee PC 4G (701) is a product combining the power of Intel® Mobile Processor. In this section, an overview for the Eee PC 4G (701), along with its components, will be presented. O V E R V I E W Eee PC 4G (701) Overview The illustrations below show the overview from front view, right side view, left side view, and rear side view. Most of the parts will be discussed in this manual.
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Service overview LAN port USB (2.0) ports Modem port SPDIF/Headphone Air Vents USB (2.
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Service overview C O M P O N E N T S Components The illustrations below show the components of the Eee PC 4G (701). L C D I N V E R T E R B O A R D LCD Panel The illustration below shows the LCD display panel. The Eee PC 4G (701) comes with 7” TFT LCD Panel. Inverter Board The illustration below shows the inverter board, which is hidden underneath the lower edge of the LCD front bezel. M O D U L E L C D H I N G E LCD Hinge The illustration below shows the LCD Hinges.
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Service overview L C D C A S E K E Y B O A R D T O P C A S E & LCD Case The illustration below shows the LCD case. Here is the LCD front cover, back cover. Keyboard The illustration below shows the keyboard plate. It can be exchanged with keyboard plates with different language layouts, such as U.S., France and others. Top Case Module The illustration below shows the top case of the Eee PC 4G (701).
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Service overview T O U C H P A D B A T T E R Y M E M O R Y Touch Pad Module The illustration below shows the Touch Pad module, top and bottom view. Battery Pack The illustration below shows the battery packs of the Eee PC 4G (701). It’s located at bottom of the EEE PC 4G (701). Memory Module The illustration below shows the memory module for the Eee PC 4G (701).
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Service overview M O T H E R B O A R D Motherboard Module The illustration below shows the motherboard module of the Eee PC 4G (701). M O D U L E B O T T O M C A S E Bottom Case Module W I R E L E S S Wireless LAN Module L A N M O D U L E The illustration below shows the bottom case module of the Eee PC 4G (701), top and bottom view. The illustration below shows the Wireless LAN Module of the Eee PC 4G (701). It contains Wireless LAN Card.
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Service overview Service Overview Please pay special attention to the cautions below to prevent any damages to the Eee PC 4G (701) and also please be sure to select the appropriate tools described in this section to perform any services desired. C A U T I O N S Precautions Before you perform any service and or repair on the Eee PC 4G (701), please follow the steps below first. 1. Be sure that the Eee PC 4G (701) is powered down. 2. Disconnect the AC plug from the Eee PC 4G (701) 3.
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Service overview 5. Always wear a ground strap on your hand to protect the Eee PC 4G (701) from static discharge. T O O L S Appropriate Tools The illustrations below show the appropriate tools that should be used for the Eee PC 4G (701)’s service and repair. C R O S S S C R E W - Phillips-head Screwdriver Use a Phillips-head screwdriver to fasten/remove the K- or B-typed screws.
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Service overview D I S A S S E M B L Y C A U T I O N S Disassembly Cautions Before you perform any service and or repair on the Eee PC 4G (701), please read the notice below first. ASUS hereby provides a basic instruction for the disassembly of ASUS products, i.e. to remove components and materials that require selective treatments, which are defined by Annex II of the European Union (EU) Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC.
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Disassembly procedure 2 Chapter Disassembly Procedure Please follow the information provided in this section to perform the complete disassembly procedure of the Eee PC 4G (701). Be sure to use proper tools described before. A SUS Eee PC 4G (701)consists of various modules. This chapter describes the procedures for the complete Eee PC 4G (701) disassembly. In addition, in between procedures, the detailed disassembly procedure of individual modules will be provided for your service needs.
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Disassembly procedure B A T T E R Y Battery Module The illustration below shows how to remove the battery module. Remove battery module 1．Slide the battery lock to open it 2．Slide the battery latch and hold the battery to remove it from system. 1 M E M O R Y M O D U L E Memory Module The illustration shows how to remove the memory module form the Eee PC 4G (701). Removing Memory module 1. Remove 2 screws (M2*4) on the memory cover then remove it from the system.
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Disassembly procedure 2. Softly open the two latches to pop the memory module up at 45 degree angles and then remove the memory at that angle. Keyboard Module K E Y B O A R D M O D U L E R E M O V A L The illustration of below shows how to remove the keyboard Removing Keyboard 1. Turn over the NB and push the 3 latches (F1; F6;Pause) on keyboard module to lift the keyboard plate.
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Disassembly procedure 2. Place the keyboard plate on the top case and disconnect the keyboard FPC to remove. Removing Keyboard Cable 1. Use a flexible connector tool to unlock the cable connector on both ends (no. 1). 2. Carefully pull out the keyboard cable (no. 2) with a pair of tweezers. 3. Lock the connector (no. 3) again to avoid possible breakage. 2. Cable out 1. Unlock 1. Unlock 3. T O P C A S E M O D U L E T O P C A S E R E M O V A L 3.
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Disassembly procedure 2. Close and turn the system upside down to remove 6 screws (M2*4) on the bottom case. 3. Softly pry the four sides of the system to open the latch hooks securing the top case with bottom case, then remove the top case.
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Disassembly procedure 4. Remove 1 piece of tape on the touch pad FPC then open the latch to disconnect it from touch pad board. 5. Remove 2 screws (M2*3) securing touch pad bracket and then remove the bracket. 6. Remove the touch pad board from the top case.
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Disassembly procedure W L A N M O D U L E WLAN Module The illustrations below show how to remove the WLAN module from the Eee PC 4G (701). Remove WLAN module W L A N M O D U L E 1. Remove 3 pieces of tape fixing the cable and then disconnect the following 4 cables, namely speaker cable, CMR cable, Fan cable, LVDS cable. R E M O V A L Speaker cable Camera cable Fan cable LVDS cable 2.
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Disassembly procedure 3. Lift the mother board from bottom case by softly separating from the bottom side, two sides to the top.* pay attention not to remove the mother board for now, for that the WLAN antenna is still connected with the mother board. 4. Turn the LCD with its back cover on the platform and hold the mother board while disconnecting the two antennas. 5. Remove the mother board from the bottom case.
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Disassembly procedure 6. Remove 2 screws (M2*4) on the WLAN module to pop up the module at 30 degree angles and then remove it at that angle. M O T H E R B O A R D M O T H E R B O A R D R E M O V A L Motherboard The illustrations below show how to disassemble and remove the Motherboard. Removing Motherboard 1. Tear off 2 pieces of tape fixing the Modem cable and disconnect the Modem cable from mother board.
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Disassembly procedure 2. Remove two screws (M2*3) securing the Modem module and then remove it from the mother board. 3. Remove 2 screws screwing the LCD hinges and then take the LCD display away. 4. Remove 1 piece of tape and 3 screws (M*4) securing the Fan module and then take the Fan module away.
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Disassembly procedure L C D L C D M O D U L E M O D U L E D I S A S S E M B L Y LCD Module The illustrations below show how to remove and disassemble the LCD module. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. Disassembling LCD Module 1. Remove 8 rubber pads and screws (M2*4) on LCD front bezel. 2. Pry the four inner sides of LCD front bezel and separate it from LCD module. 3. Remove 2 screws (M2*4) on each LCD hinge and remove both hinges.
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Disassembly procedure 4.Unscrew 4 (M2*4) screws securing the inverter board and then take the LCD panel together with the inverter board away from LCD back cover . 5. Disconnect the inverter cable, LCD FPC cable from inverter board and take the board away.
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Disassembly procedure 6. Disconnect the coaxial cable from inverter board. 7. Tear off 1 piece of tape fixing camera cable and take the camera cable off cable guide. 8. Remove the camera board from LCD back cover and then take the whole module away.
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Disassembly procedure 9. Take the WLAN antennas off cable guides and remove the antennas together with its tape from LCD back cover. 10. Take the speaker cables off cable guides and remove both speakers from their slots.
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Assembly procedure 3 Chapter Assembly Procedure Please follow the information provided in this section to perform the complete assembly procedure of the Eee PC 4G (701). Be sure to use proper tools described before. A fter you have completed the previous chapter of complete disassembly, please follow this chapter to assemble the Eee PC 4G (701) back together. This chapter describes the procedures of the complete Eee PC 4G (701) assembly.
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Assembly procedure L C D M O D U L E LCD Module The illustrations below show how to assemble and install the LCD module of the Eee PC 4G (701). 1. Install the two speakers on LCD back cover and arrange the speaker cable well through cable guide. 2. Assembly the black and white antennas on LCD back cover and well arrange the antanna cables through cable guides.
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Assembly procedure 3. Install the camera board on LCD back cover, pay attention to the aiming pole. 4. Connect the coaxial cable with inverter board. 5. Connect the inverter cable, LCD FPC cable with inverter board.
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Assembly procedure 6. Install the LCD panel together with the inverter board on LCD back cover and then secure 4 screws (M2*4) on it. 7. Assemble both hinges and secure 2 screws (M2*4) on each.*pay attention to differences between the left and right. 8. Install the LCD front bezel on LCD back cover and press the sides to fix them well.
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Assembly procedure 9. Secure 6 screws (M2*4)on LCD front bezel and then fix 6 rubber pads on it. M O T H E R B O A R D M O T H E R B O A R D Motherboard The illustrations below show how to assemble and install the motherboard of the Eee PC 4G (701). 1. Install the Fan module on bottom case, secure 3 screws on it and fix 1 piece of tape on the cable. A S S E M B L Y 2. Hold the LCD to fix its hinges on bottom case and then secure 2 screws(M2*4).
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Assembly procedure 3. Connect the Modem module with the mother board and then secure 2 scews (M2*3) . 4. Connect the Modem cable with the mother board and then arrange the cable to fix 2 pieces of tape on it.
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Assembly procedure W I R E L E S S L A N M O D U L E I N S T A L L A T I O N Wireless LAN Module The illustrations below show how to assemble and install the Wireless Lan Module of the Eee PC 4G (701). Installing Wireless LAN Module 1. Insert WLAN module into its slot at 30 degrees angles and press it down softly, then secure 2 screws (M2*4) on it. 2. Hold the mother board on bottom case and then connect the WLAN antennas with WLAN module.
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Assembly procedure 3.Install the mother board on bottom case, to install you should first install the top side,then softly pry the two sides to the ports ends fit the bottom case well, finally press the bottom side to lock the two latches.*make sure the antennas arrangeed through the hook at mother board, and all the cables placed above the mother board. 4. Install the microphone , connect it with the mother board and then fix 1 piece of tape on the cable.
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Assembly procedure 5. Connect the following cables and fix 3 pieces of tape on it.
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Assembly procedure T O P C A S E M O D U L E Top case Module The illustrations below show how to assemble and install the top case module of the Eee PC 4G (701). 1. Install the touch pad board on top case. 2. Install the touch pad bracket and then secure 2 screws (M2*4) on it.
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Assembly procedure 3. Connect touch pad FPC with touch pad board , fix the connector latch and then fix 1 piece of tape on it. 4. Install the top case with bottom case and press the four sides to make them fixed well. 5. Secure 6 screws (M2*4) on the bottom case.
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Assembly procedure 6. Connect the touch pad FPC and then secure 9 screws (M2*4) on it. K E Y B O A R D Assembling Keyboard The illustrations below show how to assemble and install the Keyboard of the Eee PC 4G (701). K E Y B O A R D 1. Connect keyboard FPC with top case.
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Assembly procedure 2. Assemble the keyboard plate and press the 3 latches (F1; F6;Pause) in keyboard to lock it. M E M O R Y M O D U L E I N S T A L L Memory Module The illustrations below show how to install the external Memory Module of the Eee PC 4G (701). 1. Insert Memory at the same 45° angles and press down until it clicks into the latches. 2. Install the Memory cover and then secure 2 screws (M2*4)on it.
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Assembly procedure B A T T E R Y M O D U L E Battery Module The illustrations below show how to install battery module of the Eee PC 4G (701). Install battery module. 1. Slide the battery module into its compartment 2. Slide on the battery lock .
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Upgrade & replacement 4 Chapter Upgrade & Replacement Follow the individual procedures in this chapter to perform the Eee PC 4G (701)’s upgrade and replacement of various major components. A sus Eee PC 4G (701) is a 2 spindles product, which means there are less options for you to upgrade and replacement. The key upgradeable and replaceable items include the Memory module.
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Upgrade & replacement M E M O R Y Memory Upgrade Upgrading Memory Module Remove battery module 1．Slide the battery lock to open it 2．Slide the battery latch and hold the battery to remove it from system. 1 Removing Memory module M E M O R Y 1. Remove 2 screws (M2*4) on the Memory cover then remove it from the system.
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Upgrade & replacement 2. Softly open the two latches to pop the Memory module up at 45 degree angles and then remove the Memory module at that angle. Installing Memory Module 1. Insert Memory at the same 45° angles and press down until it clicks into the latches. 2. Install the Memory cover and then secure 2 screws (M2*4) on it.
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Upgrade & replacement Install battery module. 1. Slide the battery module into its compartment 2. Slide on the battery lock .
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Hardware Technical Specification 5 Chapter Hardware Specifications You can enjoy and utilize the Eee PC 4G (701) Notebook more effectively with a better comprehension of detailed hardware specifications of the notebook. T his chapter lists the detailed specifications of the notebook’s main system and modules. Please refer to this section when you need to find out specific technical data about the notebook.
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Hardware Technical Specification LIST OF FIGURES 1 MARKETING SPEC Eee PC 4G (701) Specification Product Family CPU Type Speed Package L2 Cache Size Memory Type Base Memory Expansion Memory MAX LCD Size EEE PC 4G (701) Intel Celeron-M-ULV FCBGA 479 512 KB None 256/512MB/1GB 7” Interface LVDS Contrast Control None Chip Set Hot-key Onboard / Flash Module Yes Onboard 4G / Flash Module 16G Intel Sonoma Platform North Bridge Intel 910GML/910GMLE South Bridge Intel ICH6-M Super IO SO-DIMM x 1
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Hardware Technical Specification Flash ROM (SPI) Graphic Accelerator 3D Controller SST/Winbond/MXIC Intel 910GML internal GPU Yes Intel Internal graphic AGP Support No Dual view/Dual App Yes Graphic Memory TV Out Support 4Mbits Share Memory No Sound System Controller Realtek ALC662 SW wave table Yes FM synthesizer Yes Speaker Stereo I/F Azalia PC99 S/PDIF 6 channel output Audio Amplifier Microphone Modem Controller Spec I/F Yes None Yes TPA6017A2PWP Mono CONEXANT CONEXANT 56K Azalia MDC
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Hardware Technical Specification Controller Atheros L2 Internal Keyboard Key Function Key Hot Key Function 80 Keys (W/ MS-Windows function keys) 12 Function Keys 13 Hot Keys Suspend (STR or STD) Fn + F1 Wi-Fi enable Fn + F2 Application manager Fn + F6 Brightness Up Fn + F4 Brightness Down Fn + F3 LCD/CRT Fn + F5 PC Speaker Volume Fn + F7 On/Mute PC Speaker Volume Fn + F9 Volume increase PC Speaker Volume Fn + F8 Volume decrease Number Lock Fn + F11 Scroll Lock Fn + F12 Print s
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Hardware Technical Specification Glide Pad Yes Right Button Yes Left Button Yes Scroll Yes Function Control Power On Button Yes LCD Brightness Yes LCD Lid Switch Yes Sound Volume Yes Password Override Reset/Force Off I/O Port Hot Keys Hot Keys Yes (Master Password) Yes (Reset switch) All ports support hot-plug Parallel N/A CRT Yes Mouse/Keyboard N/A IrDA Port N/A Fax/Modem Yes RJ11 LAN Jack Yes RJ45 Line In Jack N/A Mic In Jack Yes Head Phone Jack Yes Stereo out USB
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Hardware Technical Specification 1st Battery 新力盛 Charging time Li-ION (5200mAH) Machine ON TBD. Machine OFF TBD. Battery Life TBD. PM Off TBD. PM On TBD. Power Management AMI BIOS LCD Close/Open Yes LCD Back-light Yes Suspend/Resume Yes Hibernation (S2D) Yes Thermal Control Yes ACPI Yes DMI 2.0 Yes Support DMI BIOS 2.
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Hardware Technical Specification 2 CHIPSET LIST Chipset Summary Table Function EEE PC 4G (701) HW ACPI/PC99 Intel Dothan Not required 512KB Not required North Bridge Intel 910GML/910GMLE YES South Bridge Intel ICH6-M YES MEMORY DDR II SDRAM Not required BIOS ROM SST/Winbond/MXIC 4Mb Not required Intel internal graphic YES CPU SRAM (L2 Cache) VGA SUPER I/O N/A PCMCIA N/A AUDIO Azalia CODEC YES AUDIO AMPLIFIER TPA6017A2PWP Not required KB CONTROLLER ENE KB3310 YES IrDA
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Hardware Technical Specification 2.1 CPU Processor Type: Intel Dothan Processor Intel Celeron-M ULV 353 Processor frequency: 900MHz (normal run 630MHz) Construction method: FCBGA479 Supply voltage: Core:0.85V(High_Frequency_Mode)~0.75V(lowest_Frequen cy_Mode) Function feature: On-die , primary 32-KB instruction cache and 32-KB writeback data cache. On-die , 512KB second level cache with Advanced Transfer Cache Architecture. Data Prefetch. Streaming SIMD extensions 2(SSE2). 400 MHZ FSB support 2.
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Hardware Technical Specification 2.2.2 Vendor: Intel Parts Number: 910GML/910GMLE Package: 1257-ball micro-FCBGA South Bridge Function: DMI x2/x4 interface link with GMCH Integrated PC/AT compatible system (DMA Controller, INT, Timer/Counters) Integrated one channels DMA/33/66/100 support IDE controller with Ultra Integrated USB 1.1 and 2.0 Host Bus controller with 8 USB ports Integrated HD Audio Interface Build-in RTC LPC Interface 2.3 2.3.
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Hardware Technical Specification 2.3.2 EXPANSION MEMORY Number of sockets: Bus: Supply voltage: One 200 pin SO-DIMM slot 64-bit data path 1.8V Functional features: 2.4 Hardware features: Supports up to 16 simultaneous open pages Supports DDR2 400 DDR devices Maximum of 2GB of system memory Parity support: without ECC BIOS ROM ROM Type: SST/Winbond/MXIC Flash Memory Package: 8-lead SOIC Supply voltage: 3.3V Serviceability: End user upgradeable for the firmware 2.
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Hardware Technical Specification 2.6 KEYBOARD CONTROLLER Function features: Embedded controller-style host Support hardware speed-up of GateA20 and RC Local 18x8 keyboard switch matrix support Three industry standard serial keyboard interfaces All three ports are bi-directional Vendor: Parts Number: Package: 2.7 KB3310 128-pin LQFP AUDIO CODEC Vendor: Realtek Parts Number: ALC662 Package: 2.8 ENE 48-pin LQFP AUDIO AMPLIFIER Function features: Max 1.
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Hardware Technical Specification 2.9 2.9.1 LAN & MODEM LAN Function features: Scatter and gather transmit receive DMA Interrupt coalescing 10Mb/s, 100Mb/s, operation Compliant to ACPI 2.0 specification Compliant to IEEE 802.3u Auto-Negotiation Support Wake-on-LAN function and remote wake up (Magic Internal transmit and receive FIFO(2KB*2) Vendor: Parts Number: Package: 2.9.2 Atheros L2 64-Pin LQFP MODEM Function features: V.
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Hardware Technical Specification 3 KEY PARTS LIST Key Parts Summary: 3.1 Display WVGA Technology: VGA+ Active color (TFT: Thin Film Transistor) Size: 7”W Resolution: WVGA (800 X 480) Dimension: 164mm(H) * 103mm(V) * 5.1mm(T) Pixel Pitch: 0.1905mm * 0.1905mm Display Colors: 16M Colors Vendor: AUO Technology: N/A Size: Resolution: Dimension: Pixel Pitch: Display Colors: Vendor: 3.2 Touch Pad Dimensions: 47.8(W) x31.9(H) x 0.85(T) (Unit: mm) Sensor Effective Areas: 35.5 (W) x 28.
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Hardware Technical Specification Vendor/Model 3.3 Synaptics : SYNAPTICS/TM-01058-002 Keyboard Function Feature: Standard Notebook-Keyboard Hardware Feature: Simultaneously use of internal and external keyboard Easily to assemble or disassemble 3.4 3.4.1 Compatibility: MS-Windows 2000/ XP Dimensions: 211.70 (H) x 80.70 (V) (Unit: mm) Type: Key switch membrane Total Travel: 1.5 +/- 0.
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Hardware Technical Specification 3.4.2 RTC Backup Battery Purpose: Backup the RTC/CMOS data While AC adapter off & Main Battery removed 3.5 Chemistry: Coin cell 2032 Li-ion battery Voltage: Nominal 3V Capacity: 200mAH Vendor: KTS AC/DC Adapter The notebook can be powered either by an external AC adapter or by an internal battery pack. The AC adapter is used as power source for the DC/DC converter and as constant current source for the battery pack.
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Hardware Technical Specification 4 SYSTEM 4.1 System diagram 4.
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Hardware Technical Specification 4.3 4.3.1 4.3.
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Hardware Technical Specification 4.3.3 PCI INT Map N/A 4.3.4 PCI Bus Master Map N/A 4.3.
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Hardware Technical Specification 5 I/O PORT PIN ASSIGNMENT No FUNCTION CRT DESCRIPTION Display (Analog) Flash module LCD KEYBOARD TOUCHPAD&LED 1ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-In .FAN .INVERTER .MDC .USB Universal Serial Bus LAN & Modem .Card Reader Universal Serial Bus .
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Hardware Technical Specification 5.1 CRT Vendor Part No. Pin No. ALLTOP C10511-11505-B 15 Pin (DIP) No Pin Assignment (by: sort) 1 RED Video (analog) Description Red this DAC analog output drives the CRT interface. 2 GREEN Video (analog) Green this DAC analog output drives the CRT interface. 3 BLUE Video (analog) Blue this DAC analog output drives the CRT interface.
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Hardware Technical Specification 5.2 Flash module pin assignment Vendor Part No. Pin No. 52 Pin (DIP) Pin No. Pin No. 1. IDE_DD0 2. IDE_DD15 3. IDE_DD1 4. GND 5. IDE_DD2 6. IDE_DD14 7. IDE_DD3 8. IDE_DD13 9. GND 10. IDE_DD12 11. IDE_DD4 12. IDE_DD11 13. IDE_DD5 14. IDE_DD10 15. GND 16. IDE_DD9 17. IDE_DD6 18. GND 19. IDE_DD7 20. IDE_DD8 21. GND 22. IDE_RST#1 23. S_SATA_RXN0 24. IDE_DIOW# 25. S_SATA_RXP0 26. IDE_PCSEL#1 27. GND 28. IDE_DIOR# 29. GND 30. IDE_DDACK# 31.
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Hardware Technical Specification 5.3 LCD pin assignment Vendor Part No. Pin No. I-PEXV WTOB_CON_20P 20 Pin (SMD) No.
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Hardware Technical Specification 5.4 Internal keyboard pin assignment Vendor Part No. Pin No.
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Hardware Technical Specification 28 NC_KSO16 O *** 5.5 Internal Touch Pad & LED Pin assignment Vendor Part No. Pin No.
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Hardware Technical Specification 5.6 1ST Battery pin assignment No Signal Description 1 BAT_IN# 2 BAT I 3 BAT I 4 BAT_ID O 5 GND 6 BAT_TS 7 P Ground P O O BAT_CONFIG 8 NC NC 9 5.7 Power Type Ground GND P DC in Jack pin assignment Vendor Part No. Pin No.
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Hardware Technical Specification 5.8 Audio Jack 5.8.1 Internal Speaker Jack Vendor Part No. Pin No. ACES WtoB_CON_4P 4 Pin (SMD) No Signal Description Type 1 INTSPKR- Internal speaker signal right channel negative O 2 INTSPKR+ Internal speaker signal right channel positive O 3 INTSPKL- Internal speaker signal left channel negative O 4 INTSPKL+ Internal speaker signal left channel positive O 5.8.2 Headphone Jack Vendor Part No. Pin No.
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Hardware Technical Specification 5.8.3 Microphone Jack Vendor Part No. Pin No. SUYIN PHONE_JACK_6P 6 Pin (DIP) No Signal Description Type 1 GND_AUDIO Ground 2 MIC1_JACK_L External microphone input I/O 3 MIC1_JACK_R External microphone input I/O 4 GND_AUDIO Ground P 5 MIC_SW# Control internal MIC O 6 NC NC 5.9 P NC Fan Pin Assignment Vendor Part No. Pin No.
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Hardware Technical Specification 4 None None NC 5 GND Ground P 6 +3VAUX_MDC 3.3V power turned off during S4 P 7 ACZ_SYNC_MDC Azalia sync signal I 8 GND P 9 ACZ_SDIN1_MD Azalia data input signal C O 10 GND P 11 ACZ_RST#_MDC Azalia reset signal _R I 12 ACZ_BCLK_MDC Azalia bit clock signal I Ground Ground 5.11 USB pin assignment Vendor Part No. Pin No.
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Hardware Technical Specification SUYIN USB_CON_1X4P No 4 Pin (SMD) Signal Description Type 1 +5V_USB34_CON USB 5V power P 2 USBPN3 USB port 3 negative signal I/O 3 USBPP3 USB port 3 positive signal I/O 4 GND USB 5V ground P 5.12 LAN & Modem pin assignment Vendor Part No. Pin No.
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Hardware Technical Specification 5.13 Card Reader pin assignment Vendor Part No. PANASONIC SD_SOCKET_9P Pin No Signal 1. UB_SD_DATA3 2. UB_SD_CMD 3 GND 4 +3V_SD 5 UB_SD_CLK 6 GND 7 UB_SD_DATA0 8 UB_SD_DATA1 9 UB_SD_DATA2 Pin No.
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Hardware Technical Specification 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin +12V VSUS_ON Other Control +5V SUSB_ON LCD, Flash, Flash & Wlan LED, Fan, Camera, Codec, Audio, SB +3V SUSB_ON NB IO, SB, LCD, Card reader, Codec, Audio +1.8V_DUAL SUSC_ON NB, DDR2 power +5VSB VSUS_ON SB, USB, Charge & Power LED +3VSB VSUS_ON SB, Audio, Clock Generator, PCIE interface +1.5V SB Core, NB Core +2.
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Hardware Technical Specification clock (SUSCLK) in this suspend mode to support refresh of these memory subsystems. Only an enabled “resume event” can bring the platform out of the suspend to RAM (STR) state. 6.2.5 Suspend to disk mode (STD) A suspend state where the context of the entire system is saved to disk, all motherboard components are powered-off, and all clocks are stopped. Any enabled “resume event”, such as Power switch or RTC, can bring the platform out of the suspend to disk (STD) state.
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Hardware Technical Specification 6.3.1 Lid switch Display mode State Lid close Lid open LCD Full on LCD OFF No action Stand by LCD OFF No action STR/STD LCD OFF No action Full on No action No action Stand by No action No action STR/STD No action No action Full on LCD OFF/CRT ON No action Stand by No action No action STR/STD No action No action CRT SIMUL LCD display will be shut down while closing LCD. 6.3.
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Hardware Technical Specification Modem ON Power down Power Off Power Off WLAN ON Power down Power Off Power Off 6.4.
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Hardware Technical Specification 6.4.
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Hardware Technical Specification 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the following PCB assembly and modules. 7.1.1 Board assembly Processor Upgradeable CPU (FCBGA 479) Main Board Main System board Inverter Board LCD Module Back-light TOUCH PAD&AUDIO DJ 4 LED Indicators, 2 Touch Pad Button, 5 Audio DJ BOARD button 7.2 SO-DIMM Module Memory Expansion Modem Board MDC Processor Feature: Celeron M CPU with on-die L2 cache.
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Hardware Technical Specification 7.3 7.3.
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Hardware Technical Specification 7.3.2 DC/DC module spec Controller: ISL6262CRZ, TPS51020, ISL6227CAZ, Input voltage: 8-20V Output voltage/current: Voltage Current Regulation +3VA 60mA +-5% +3VSB 1.74A +-5% +5VSB 1.38A +-5% +1.5V 1.88A +-5% +5V 1.09A +-5% +3V 566Ma +-5% +2.5V 100mA +-5% +1.8V_DUAL 4.5A +-5% VTT_DDR 121mA +-5% +VCCP 2.07A +-5% VCORE 2.96A +-5% Support OVP Support OCP 7.3.3 Charger Charger spec Controller: MAX8724ETI Input voltage: 9.
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Hardware Technical Specification Charge current (4S2P) 2.4A 2.46A 2.6A Charge current (4S1P) 1.3A 1.4A 1.5A Ripple & Noise 100mV Efficiency 94% 7.
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Hardware Technical Specification 7.5.3 Protection OVP: 24V(max) SCP: Yes OCP: 19V/5A(max) 7.6 Main Battery spec Battery pack capacity: Li-Ion Vendor Cells Voltage Capacity 新力盛 4 7.4V 2600mAh Watts Battery warning and low percentage (Li-Ion): Battery low = 7% Battery low low= 0% Gauge controller (BQ2060H) setting: Charging voltage:8.36V Charging efficiency: 95% Low temperature capacity: 70% 7.7 LAN Spec Controller: Atheros L2 Interface: PCIE Compliant to PCI 2.
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Hardware Technical Specification 7.8 Modem spec Part Number: ASUS RD01-D480 Controller: Conexant software modem Interface: AC-link Support Caller ID Support Ring wake up function ITU-T V.90 Data Mode with auto-fall back to K56flex and V.34 V.80 Video ready Modem Data speed: 56Kbps FAX transfer speed: 14.4Kbps Modem modulation format: V.
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Hardware Technical Specification 8 8.
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Hardware Technical Specification 8.2 Power cord list Where TBD Description Vendor US UK Japan Europe Austria South Asia 8.3 Safety/ EMI Appliance : Agency Approval EMC CE Mark (Europe) BSMI (Taiwan) EMI FCC Class B Certified (USA & Canada), VCCI (Japan) MIC, IDA Other Requirements Safety UL, CSA or CUL, NEMKO-CB (Norway), TUV, CE Mark (Europe) Telecomm.
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Software Specification 6 Chapter Software Specifications Get to know more about the Eee PC 4G (701) Notebook with a detailed look at the software specifications. T he information contained in the chapter can be quite useful when you are troubleshooting the system’s hardware. Each item has its individual usage for you to Understand the software side of the notebook’s architecture.
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Software Specification 1. General Description The specification is a guideline for BIOS development on 701 platforms. Anyone who needed the system BIOS information can check this document for reference. The general device specification, hardware block diagram, SMBUS, GPIO definition and so on are subjected to be depicted in this document. Hotkeys implementation and other BIOS features are also included in the document.
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Software Specification 2. CPU, Chipsets & Main Devices Item Vendor Specification Part’s Name CPU INTEL Dothan single core North Bridge INTEL 910GML South Bridge INTEL ICH6M VGA Internal HD Controller Internal Audio Codec REALTEK USB INTEL Lan Athros ALC662 L2 DDR2 Flash memory ICS ICS9LR367 ENE KB3310 Wireless Lan Atheros AR5006X Camera Azure Wave AZWAVE CardReader PANASONIC ICS9LPR426AGLF-T modem Askey AFM6010NAM Clock Gen.
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Software Specification Main component block diagram: 6-4
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Software Specification 3. Device resources 3.1 Subsystem and Sub vendor ID of PCI Devices Device INTEL Bus/Dev/ Func Function 0,0,0 Host Bridge Vendor Device Sub-Vendor Sub-System ID ID ID ID 0x8086 0x1043 0x1882 0.2.0 VGA 0x8086 0x2592 0x1043 0x1882 0.31.2 IDE controller 0x8086 0x2653 0x1043 0x8290 Realtek 0.27.0 Audio controller 0x8086 0x2668 0x1043 0x82A1 Athros 3.0.0 LAN 0x1969 0x2048 0x1969 0x2048 Table3-1 3.2 0x2590 Devices I/O Base Table3.
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Software Specification 4. Specified Function Tables The Specified Functions are controlled via General Purpose Pins of Chipsets, following tables are the definition of The Functions which controlled via the GPIO pins of South-Bridge (ICH6M). Table 4-1.
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Software Specification 5. Setup Menu 701 system BIOS allows users to change some system hardware/function settings during POST (power on self test) stage, users may hit F2 key to enter SETUP mode in POST, the setup feature is categorized into 4 menus described as below. 5.1 Main Menu Main menu describes system overall information with some user changeable setting, it contains below items. 1. 2. 3. 4. 5. 6. System Firmware: Current version for the system, EC and VGA BIOS.
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Software Specification 5.2 Advanced Menu In advanced menu the users may configure IDE configuration, onboard devices and OS to install type settings may be changed as well. Detailed settings are described below. 1. IDE configuration: See 5.2.1 2. Onboard Devices Configuration: See 5.2.2 3.
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Software Specification 5.2.1 IDE Configuration 1. 2. IDE Master: See details. IDE Slave: See details.
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Software Specification 5.2.2 Onboard Devices Configuration: 1. 2. 3. 4. 5. 6. 7. 8.
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Software Specification 5.3 Security Menu 701 BIOS supports three kinds of password for security protection: 1. Supervisor Password: Users may set, change or erase system password, the password data is saved in non-volatile device (CMOS), system password check is done during POST(Power On Self Test). The BIOS will prompt a dialog message to ask user for password check when: The system has password stored, and “Password on boot” setting in BIOS SETUP is enabled.
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Software Specification 5.4 Boot Menu In this menu users can decide the boot sequence, as long as the device with highest boot priority exists, system BIOS will boot from it, device boot priority is adjusted by pressing “+”,”-“ or space key on the selected (highlighted) item. 3 bootable devices fare listed in this menu (BIOS default boot sequence). 1. Boot Device Priority: See 5.6.1 2. Boot Settings Configuration: See 5.6.2 3.
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Software Specification 5.4.1 Boot Device Priority In this menu specifies the boot sequence from the available devices. User can change boot devices priority.
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Software Specification 5.4.2 Boot Settings Configuration 1. Quick Boot: [Enabled] decrease time when boot. 2. Quiet Boot: [Disable]: Display normal POST messages. [Enable]: Displays OEM Logo instead of POST messages.
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Software Specification 5.5 Exit Menu In Exit BIOS setup, users may make final decision if they want to save the change just made or load BIOS default setting. 1 2 3 4 Exit & Save Changes: Exit system setup after saving the changes. Exit & Discard Changes: Exit system setup without saving any changes. Discard Changes: Discards changes done so far to any of the setup questions. Load setup Defaults: Load Optimal Default values for all the setup questions.
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Software Specification 6. Device resources 701 uses ICH6M chipset as its power management core logic, the chipset supports most features the ACPI 2.0 interface specifies, for ACPI 2.0 compliant OS. The BIOS has below features implemented: (1). System sleep states: The system supports: (a). S0 state: The CPU and all devices are working. (b). S3 state: system is in low power state, with all setting saved into RAM. Most of the devices are power off (c).
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Software Specification 7 Embedded Controller (EC) 7.1 Hot Key Table 8.1.
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Software Specification 8. Thermal Policy There is only one CPU fan in this project. The controlling method is to plan several step thermal ranges then every range mapping to different fan speed. The following table is thermal policy table and Fan Curve.