/15 29.10.2019 Integration guide COPA Mesh FCC ID: 2AOFP- E0048 Anticimex Innovation Center A/S Skovgaardsvej 25 3200 Helsinge, Denmark Phone +45 48 79 93 78, AIC@anticimex.com anticimex.com/innovationcenter Reg no.
/15 29.10.2019 Table of Contents References................................................................................................................................................................... 3 COPA Mesh module overview............................................................................................................................. 3 Compliance statement................................................................................................................................
/15 29.10.2019 References [1] CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU, Technical datasheet COPA Mesh module overview The COPA mesh module consists of a sub-GHz wireless MCU (CC1312R from TI), a PCB antenna, a Lithium-type battery, memory, PIR sensor, power circuitry, temperature sensor, LEDs and several different GPIOs to interface with the outside world.
/15 29.10.2019 - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. COPA Mesh module block diagram (See next page) Anticimex Innovation Center A/S Skovgaardsvej 25 3200 Helsinge, Denmark Phone +45 48 79 93 78, AIC@anticimex.com anticimex.com/innovationcenter Reg no.
/15 29.10.2019 Tech TX frequencies Sub-GHz 917-926 MHz (US) Sub-GHz 868.3 MHz (EU) Edge Connector COPA Mesh module 3.3V AUX_VDDS TVS diodes Sub-GHz PCB Antenna Flash memory LPF 6 GPIOs Lowpass Filter 3x 3 External ID Lines Reset button C RAM memory Button interface LED Balun P RF_P RF_N SPI DIO 48MHz VEXT_SENSE CC1312R 32.768kHz DIO DIO DIO DIO 3.3V VDDS 2 DIOs PIR sensor Batt_Sense 3.3V VDDS VEXT_ON External supply pins VDDS_3V6 Power sub system 3.
/15 29.10.2019 Module features The COPA mesh module is a single-modular transmitter designed to be incorporated into products either as a stand-alone board or connected together with other PCBs (sensor specific boards). The module has the radio circuitry shielded (including crystals, balun and low pass filter) by a shield can and underlying ground layers in the 4 layer PCB. There are no modulation inputs to the board, IQ-data is entirely generated inside the transceiver module itself.
/15 29.10.2019 Connector mapping Signals Description Type Nbr of lines Voltage range Max voltage External ID lines Used to identify which type of device the COPA mesh module is connected to. DIO 3 See [1] VDDS+0.3V (max 4.1V) GPIOs General DIO purpose inputs/outputs 6 See [1] VDDS+0.3V (max 4.1V) Button Interface Low level if button pressed, VDDS if not pressed DIO 1 See [1] VDDS+0.3V (max 4.
/15 29.10.2019 Power Architecture The COPA mesh module will have a 3.6V Lithium-type battery mounted all the time. It can use an external power source which it detects through a sense line. The battery is then disconnected immediately using FETs. External voltage FETs are also controlled from the MCU, first off then on to make sure the battery and mains do not get connected at the same time. On-board capacitors will help bridge the small time required for switching.
/15 29.10.2019 Radio description COPA Mesh module hardware implementation The sub-GHz radio of the mesh module is a combined MCU/radio transceiver (CC1312R1F3RGZ from TI) containing all the logic to run the board. The CC1312R has a supply range of 1.8V to 3.8V with nominal voltage of 3.3V. The RF signals are entirely generated internally in the CC1312R device (see block diagram), including the IQ-signals. The frequency reference of the CC1312R radio is an external 48MHz crystal.
/15 29.10.2019 Receive path The antenna receives the electro-magnetic waves and generates a single 50Ω ended signal. This signal is impedance transformed and converted to a differential signal through a discrete balun then the differential signals enter the chip through RF_N and RF_P. Inside the chip, the signal is then amplified through a two stage differential RF LNA. The amplified RF signal is down converted through an IQ differential down converting mixer.
/15 29.10.2019 SUB-GHz Signal characteristics for FCC compliance Signal is a wideband DTS signal without frequency hopping for compliance with FCC 15.247.
/15 29.10.2019 FHSS; No Modulation type; WB-DSSS with 4x spreading factor, 2-GFSK, FEC=2 Figure 2 WB-DSSS Coding Scheme (modulator is 2-GFSK) Data rate; 30kbps Frequency deviation; 120kHz Grounding systems; Grounding of all PCBs interconnected through the PCB edge connectors.
/15 29.10.2019 Integration instructions Label requirements If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module, Contains FCC ID: 2AOFP-E0048 Allowed operating frequencies; 917-926MHz (center frequency) for the US 868.
/15 29.10.2019 evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369. In the case that the host product is energizing the COPA Mesh module through external power supply pins of the edge connector the host device must indicate presence of external voltage on the VEXT_SENSE pins of the edge connector.
/15 29.10.2019 Total thickness with soldermask: 1046um ±10% PCB material shall be FR4 Std. Tg 150˚C min. (according to IPC-4101/121 or IPC-4101/124). Anticimex Innovation Center A/S Skovgaardsvej 25 3200 Helsinge, Denmark Phone +45 48 79 93 78, AIC@anticimex.com anticimex.com/innovationcenter Reg no.
