WF60 User manual Amp’ed RF Technology, Inc. www.ampedrftech.
WF60 Product Specification Features WLAN 802.11a: OFDM 802.11b: DSSS 802.11g/n-HT20: OFDM Dual Band: 2.4GHz and 5GHz 13.5mm x 14.6mm x 2.7 mm Lower sub-band: U-NII-1: 5150-5250MHz Higher sub-band: U-NII-3: 5725-5850MHz Description Amp’ed RF Tech presents the WF60 dual band Output Power, +22.5dBm WiFi module: 802.11abgn.
Contents 1. 1.1. 1.2. 1.3. Hardware Specifications ................................................................................................... 4 Recommended Operating Conditions ................................................................................................................ 4 Absolute Maximum Ratings ............................................................................................................................... 4 I/O Operating Conditions ..............................
1. Hardware Specifications General Conditions (VIN= 3.6V and 25°C) 1.1. Recommended Operating Conditions Rating Min Typical Max Unit Operating Temperature Range -10 - 60 °C Supply Voltage VIN 2.3 3.6 4.8 Volts Signal Pin Voltage - 1.8 - Volts RF Frequency 2400 - 2483.5 MHz 1.2. Absolute Maximum Ratings Rating Min Typical Max Unit Storage temperature range -55 - +150 °C Supply voltage VIN -0.3 - +5.0 Volts I/O pin voltage VIO -0.3 - +2.
2. Hardware Block Diagram 2.4GHz 5GHz ACC1340 WLAN RF Switch Crystal 26MHz ±20ppm www.ampedrftech.
3. Hardware Design All unused pins should be left floating; do not ground. All GND pins must be well grounded. The area around the antenna should be free of any ground planes, power planes, trace routings, or metal for at least 6.5 mm in all directions. Traces should not be routed underneath the module. ANT 2.4G and ANT 5G:RF bi-directional antenna port matched to 50Ω, molex 1461530100. RF traces must be as short as possible for best RF performance，like below.
3.1. Module Reflow Installation The WF60 is a surface mount Bluetooth module supplied on a 18 pin, 6-layer PCB. The final assembly recommended reflow profiles are: For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended. Maximum peak temperature of 230° - 240°C (below 250°C). Maximum rise and fall slope after liquidous of < 2°C/second. Maximum rise and fall slope after liquidous of < 3°C/second. Maximum time at liquidous of 40 – 80 seconds. www.ampedrftech.
4. Startup behavior 4.1. RESET and PMUEN A valid reset shall be obtained by maintaining RESET active (low) for at least two cycles of LPO after VIN is stable within its operating range. There is no constraint on the activation of the other supplies during this process. 4.2. SDIO and SPI interface SDIO 5 is the selection pin; the state of this pin is monitored on the rising edge of RESET. LOW selects SPI HIGH selects SDIO 5.
To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
susceptible d’en compromettre le fonctionnement. This equipment complies with radio frequency exposure limits set forth by the Innovation, Science and Economic Development Canada for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the device and the user or bystanders. This device must not be co-located or operating in conjunction with any other antenna or transmitter.
