Bluetooth Module BLE60/BLE63 Datasheet Amp’ed RF Technology, Inc. www.ampedrftech.
BLE60/BLE63 Product Specification BLE60/BLE63 features Bluetooth features Bluetooth v4.2 Smart Ready 1Mbps data throughput 128-bit encryption security Hardware configuration 13.5mm x 10.5mm x 2.6mm l Cortex-M0 microprocessor l 128K bytes Flash memory l 64Kbytes RAMmemory BLE60/BLE63 Smart Ready Bluetooth module l 96Kbytes ROM memory supporting Energy.
Table of Contents 1. 1.1. 1.2. 1.3. 1.4. 1.5. 1.6. 1.7. 1.8. Hardware Specifications ........................................................................................................ 4 Recommended Operating Conditions ...................................................................................................................... 4 Absolute Maximum Ratings .....................................................................................................................................
1. Hardware Specifications General Conditions (VIN= 3.0V and 25°C) 1.1. Recommended Operating Conditions Rating Min Typical Max Unit Operating Temperature Range -40 - 85 °C Supply Voltage VIN 2.4 3.0 3.6 Volts Signal Pin Voltage - 0.7VVDDIO~ VDDIO - Volts RF Frequency 2400 - 2483.5 MHz 1.2. Absolute Maximum Ratings Rating Min Typical Max Unit Storage temperature range -55 - +150 °C Supply voltage VIN -0.3 - +5.0 Volts I/O pin voltage VIO -0.3 - +5.
1.4. Selected RF Characteristics Parameters Conditions Antenna load Typical Unit 50 ohm Radio Receiver Sensitivity level BER < .001 with DH5 -92 dBm Maximum usable level BER < .001 with DH1 0 dBm Input VSWR 2.5:1 Radio Transmitter 50 Ω load Maximum output power +4 dBm Initial Carrier Frequency Tolerance 0 kHz 20 dB Bandwidth for modulated carrier 935 kHz 1.5. I/O Operating Characteristics Symbol Parameter Min Max Unit Conditions VIL Low-Level Input Voltage - 0.
1.6. Pin Assignment Name Type Pin # Description UART Interface RXD1 I 13 Receive data/ SPI_MISO TXD1 O 14 Transmit data/SPI_MOSI RTS1 O 12 Request to send (active low)/ SPI_CLK CTS1 I 11 Clear to send (active low) /SPI_CS VIN 8 VIN GND 7 GND GND 18 GND 10 Reset input Power and Ground Reset RESETN I LPO Low power clock input LPO I 15 Connect an external source when using PN: BLE60.
1.7. Pin Placement Diagram (Top View) www.ampedrftech.
1.8. Layout Drawing 13.5 mm x 10.5 mm x 2.6 mm (+/- 0.2mm, height tolerance)) www.ampedrftech.
2. Module Block Diagram An external source may optionally supply the slow clock to the LPO pin when using PN: BLE60/BLE63. This clock is already supplied on the module with PN: BLE60/BLE63_LP, and no additional circuitry is needed. www.ampedrftech.
3. Hardware Design Notes All unused pins should be left floating; do not ground. All GND pins must be well grounded. The area around the antenna should be free of any ground planes, power planes, trace routings, or metal for at least 5 mm in all directions. Traces should not be routed underneath the module. The BLE60s/BLE63s must be reprogramed via UART0. 3.1. Module Reflow Installation The BLE60/BLE63 is a surface mount Bluetooth module supplied on an 18 pin, 6-layer PCB.
3.3. PCB Layout Guidelines 3.4. External LPO Input Circuit An external source may optionally supply the slow clock to the LPO pin when using PN: BLE60/BLE63. This clock is already supplied on the module with PN: BLE60/BLE63_LP, and no additional circuitry is needed. The source must be a digital signal in the range of 0.1V to Vcc. The accuracy of the slow clock frequency must be 32.768 KHz ±100 ppm. 3.4.1.
3.4.2. External LPO circuit example External LPO Reference Circuit www.ampedrftech.
3.5. Application Reference Design 3.5.1. Reference Design with EXT LPO www.ampedrftech.
3.5.1. Reference Design with INT LPO Notes: The LPO pin should be left floating; do not ground. 4. Regulatory Compliance Federal Communications Commission statement: This module has been tested and found to comply with the FCC Part15. These limits are designed to provide reasonable protection against harmful interference in approved installations.
(A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: X3ZBLEMOD1” or “Contains FCC ID: X3ZBLEMOD1.
(1)L’appareil ne doit pas produire de brouillage; (2)L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. 4.1. Modular Approval, FCC and IC FCC ID: X3ZBLEMOD1 IC: 8828A-BLE1 In accordance with FCC Part 15, the BLE60/BLE63 is listed above as a Modular Transmitter device. 4.2. FCC Label Instructions The outside of final products that contain a BLE60/BLE63 device must display a label referring to the enclosed module.
FCC ID: X3ZBLEMOD1 IC: 8828A-BLE1 Any similar wording that expresses the same meaning may be used. 4.3. CE Label Instructions TBD 4.4. Bluetooth Certification Bluetooth QDID: 5. Ordering Information Part Name Description BLE60 BLE module, no LPO BLE60_LP BLE module, with LPO BLE63 Audio BLE module 6. Revision History Date Revision Description 28, Dec 2018 1.0 Initial version 10, Jan, 2019 1.1 Added application reference design 27, Mar, 2019 1.2 Updated pinout chart 30, Apr, 2019 1.
