User's Guide

UG- HS6621 _1.0 P.1/6
Alereon HS6621 UWB Radio Module User Guide
INTRODUCTION
The HS6621 UWB Radio module is a complete compact UWB radio implemented in a
standard PC Mini-Card format that is intended to be embedded within a product to
provide UWB functionality.
The HS6621 combines the Alereon AL5000 chipset along with on board power supplies,
an antenna output, a USB function controller and a USB 2.0 system interface.
1.0 REFERENCE DESIGN FEATURES
Optimized Performance with AL5100 (3.1GHz to 8.976GHz) WiMedia BG#1, 3, 6
Complete Baseband Processor (BBP) and Media Access Controller (MAC)
High Precision Data Path and Data Converters allowing reliable link at extended
ranges
Fully Integrated MAC Protocol Engine Supports All Industry Standards WiMedia
protocols
- Certified Wireless USB
- WiMedia Link Layer Protocol
- Bluetooth 3.0 (supported by future SW releases)
Industry Standard Interfaces
- USB 2.0 – Data
- USB 2.0 – WiMedia Cable Association
Power requirements:
o +3.3V ±5%, 0.75A Maximum
Small Form Factor (Minicard form factor)
3 GPIO lines for LED Indicators or additional system control signals
Operating temperature / humidity range: 0°C to +50°C / 10% to 80% RH
2.0 Usage and Documentation
The HS6621 is a complete, self-contained UWB radio module requiring only +3.3V
regulated power from the host system and providing USB 2.0 interfaces to the host
system for data and the WiMedia association function. The AL5712 is intended to
provide a simple path for a wired USB product design to migrate to a UWB enabled
wireless USB product design.
The HS6621 is a wireless USB certified platform and has received FCC approval as a
Modular UWB transmitter under subpart F of the FCC rules with the FCC ID:
A3LCYWDCA7UR . The product implementation can apply these approvals to the
product which incorporates the HS6621 .
This document provides an outline of the purpose and functionality provided by the
HS6621 , complete information for the product system designer is contained in the
Samsung Reference Design Kit (RDK) package consisting of: Schematic diagram, BOM,
and PCB fabrication information including a full Gerber data set.

Summary of content (6 pages)