承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN2012F245C04 規格 DESCRIPTION ： Chip Antenna 2012 L Ant 2.45G Type 04 版本 VERSION ： V1.7 日期 ISSUE DATE ： 2022/03/08 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112 台北市北投區立功街 151 號 1 樓 1F, No.
012 Chip antenna For Bluetooth / WLAN Applications P/N: WAN2012F245C04 Dimension (mm) L 2.05 ± 0.20 W 1.23 ± 0.20 T 0.45 ± 0.20 ONEWAVE TECHNOLOGY CO., LTD.
Part Number Information WAN 2012 A A B C D E F B F 245 C 04 C D E F Product Series Dimension L x W Material Working Frequency Feeding mode Antenna type Antenna 2.05X1.23mm ( ± 0.2mm) High K material 2.4 ~ 2.5GHz PIFA & Single Feeding Type = 04 1. Electrical Specification Specification Part Number WAN2012F245C04 Central Frequency 2450 MHz Bandwidth 85 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.
2. Recommended PCB Pattern Evaluation Board Dimension (board size 80x40mm) 2nd Evaluation Board Dimension Evaluation Board Dimension (board size 80x40mm) Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 1.0pF ONEWAVE TECHNOLOGY CO., LTD.
Layout Dimensions in Clearance area( Size=3.0*5.0mm) Tuning Component Matching circuit FootPrint ◆ (Unit : mm) 2nd Layout Dimensions in Clearance area( Size=8.0*2.5mm) Matching circuit Tuning Compon ONEWAVE TECHNOLOGY CO., LTD.
3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD.
Radiation Pattern Z X Y Efficiency Peak Gain Directivity 2400MHz 63.12 % 1.62 dBi 3.61 dBi 2450MHz 70.56 % 1.72 dBi 3.23 dBi 2500MHz 65.48 % 1.64 dBi 3.47 dBi Chamber Coordinate System ONEWAVE TECHNOLOGY CO., LTD.
4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage TEMP (℃) 4±1 sec. Pre-heating temperature:150℃/60sec. Solder temperature:230±5℃ Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin 10±0.5 sec. Pre-heating temperature:150℃/60sec. Solder temperature:260±5℃ Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin 230℃ 150℃ 60sec Solder heat Resistance 1.
5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Iron Soldering Reflow Soldering PRE-HEATING SOLDERING TEMPERATURE(°C) 10s max.
6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) 8 9.0±0.5 60±2 C(mm) D(mm) 13.5±0.5 178±2 ONEWAVE TECHNOLOGY CO., LTD.
7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2.
