Product Name Version Doc No Date S76S LoRa Wireless Communication Module H 901-10201 Mar 22nd, 2017 0
Document History Date Revised Contents Revised By Version Chunyi A July 20th ,2016 Draft Version Aug 25th ,2016 Revised 7.1 marking without logo Nick B Sep 10th ,2016 Revised marking with Acsip logo Nick C Sep 26th ,2016 Revised 4.1 footprint drawing Nick D Oct. 7 th ,2016 Update footprint Nick E Oct.
1. General Description The S76S integrates ARM Coretex®-M0+ (32-bit RISC core operating at a 32MHz frequency) MCU with LoRaTM modulation that provides ultra-long range spread spectrum communication and high interference immunity whilst minimizing current consumption. S76S can achieve a sensitivity of over -137 dBm. The high sensitivity combined with the integrated +20 dBm power amplifier yields industry leading link budget making it optimal for any low data rate application requiring range or robustness.
1-1 Block Diagram A simplified block diagram of the S76S module is depicted in the figure below. 1-2 Product Version The features of S76S is detailed in the following table Part Frequency Spreading Bandwidth Effective Est. Sensitivity Number Range Factor (K Hz) Bitrate (bps) ( dBm ) 6 - 12 62.5 - 500 146 - 37500 -109 to -137* S76S 902.3-914.9 MHz Note: * LORA setting SF=12, BW=62.5k, Long-Range Mode, highest LNA gain, LnaBoost for Band 1.
2. Electrical Characteristics 2-1. Absolute Maximum Ratings Symbol VDD33 Parameter Min. Typ. Max. Unit Supply Voltage -0.3 3.9 V VIN Input voltage on digital pins -0.3 3.9 V Pmr RF Input Level +10 dBm 2-2. Recommended Operating Range Symbol Parameter VDD33 Supply Voltage ML RF Input Level Min. Typ. Max. Unit 2.0 3.3 3.6 V +10 dBm 2-3.
2-4. RF Characteristics The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V. Temperature = 25° C. Frequency bands: 915 MHz Bandwidth (BW) = 125 kHz. Spreading Factor (SF) = 12. Error Correction Code (EC) = 4/6. Packet Error Rate (PER)= 1% CRC on payload enabled. Output power = 13 dBm in transmission. Payload length = 64 bytes.
2-5. Digital Characteristics 2-5-1. DC characteristics Input voltage levels Symbol Description VIH VIL RPU RPD I/O input high level voltage I/O input low level voltage Weak pull-up Equivalent resistor Weak pull-down Equivalent resistor Conditions Min NRST Typ. Max Unit 0.7xVDD33 - - V BOOT0 0.7xVDD33 - - V GPIO 0.7xVDD33 - - V NRST - - 0.3xVDD33 V BOOT0 - - 0.14xVDD33 V GPIO - - 0.
2-5-2. NRST pin characteristics The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor (RPU). The following figure is recommended NRST pin protection circuit against parasitic resets. Symbol Description VIL(NRST) NRST input low level voltage VIH(NRST) VOL(NRST) VOL(NRST) Vhys(NRST) RPU Conditions NRST input high level voltage Min Typ. Max Unit VSS 0.8 V 1.4 VDD33 V NRST output low level voltage IOL = 2mA 2.7V＜VDD33＜3.6V 0.
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31 GND Ground pin 32 GND Ground pin 33 RF_ANT 34 GND Ground pin 35 GND Ground pin 36 PA1_RF_FEM_CPS 37 GND 38 NC 39 GND 40 NC 41 GND 42 NC 43 VDD33 Power Supply 44 VDD33 Power Supply 45 PA8_USART1_CK I/O MCU pin name: PA8 46 PA10_USART1_RX I/O MCU pin name: PA10 47 PA9_USART1_TX I/O MCU pin name: PA9 48 PA11_USART1_CTS I/O MCU pin name: PA11 49 PA12_USART1_RTS I/O MCU pin name: PA12 50 PA13_SWDIO Serial wire (SWD) debug interface 51 PA14_SWCLK Seria
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4-1 Recommended Footprint Unit: mm TOP View Product Name Version Doc No Date Page S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 13 of 18
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6. SiP Module Preparation 6-1. Handling Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and tested, it should be transport and storage with anti -static tray and packing. This protective package must be remained in suitable environment until the module is assembled and soldered onto the main board. 6-2. SMT Preparation 1. Calculated shelf life in sealed bag: 6 months at<40℃ and <90% relative humidity (RH). 2. Peak package body temperature: 250℃.
7. Package Information 7-1. Product Making Figure 1 below details the standard product marking for all AcSiP Corp. products. Cross reference to the applicable line number and table for a full detail of all the variables.
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7-3. Packing Information 7-4.
8. FCC statement Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna, 3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. As long as 3 conditions above are met, further transmitter test will not be required.
