802.11b/g/n WM-N-BM-02_D-REF1 Data Sheet November 18 2013 Rev 2.1 www.usi.com.tw Data Sheet of WM-N-BM-02_D-REF1 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 1 .
802.11b/g/n Wireless LAN Daughter board V2.1 Introduction This daughter card featured with full function of 802.11b/g/n including WM-N-BM-02. This multi-functionality via LGA to connect and provides SDIO/SPI (option) interface for WiFi. The small dimension and low profile physical design make it easier for system design to enable high performance wireless connection without space constrain.
802.11b/g/n Wireless LAN Daughter board V2.1 Change Sheet Rev. Date Description of change Page Par. Change(s) 1.0 02/06/13 All All Draft version for Review 1.1 03/16/13 All All Add Rx item 1.2 03/20/13 6 2 Add PMU account 1.3 04/19/13 6 2 Modify the picture 1.4 06/21/13 All All Customer requirement 1.5 06/25/13 25 all Recommended MSD baking specification 1.6 07/02/13 11 5.5 1.7 07/17/13 All All WM-N-BM-02_D-REF1 1.
802.11b/g/n Wireless LAN Daughter board V2.1 TABLE OF CONTENTSINTRODUCTION Features ................................................................................................................................... 1 1. EXECUTIVE SUMMARY.................................................................................................... 5 2. BLOCK DIAGRAM ............................................................................................................ 6 3. DELIVERABLES.......................
802.11b/g/n Wireless LAN Daughter board V2.1 1. EXECUTIVE SUMMARY The WM-N-BM-02_D-REF1 is one of the product families in USI’s product offering, targeting for system integration requiring a smaller form factor. It also provides the standard migration to high data rate to USI’s current SIP customers. The purpose of this document is to define the product specification for 802.11b/g/n WiFi WM-NBM-02_D-REF1.
802.11b/g/n Wireless LAN Daughter board V2.1 2. BLOCK DIAGRAM The WM-N-BM-02_D-REF1 is based on Broadcom BCM43362 solution. It supports generic SPI (G-SPI), SDIO interface to connect the WLAN to the host processor. Below is a simplified block diagram of WM-N-BM-02_D-REF1: WM-N-BM-02_D-REF1 is WM-N-BM-02 on Daughter Board The BCM43362 contains a Power Management Unit (PMU), a buck mode switching regulator, and three low noise LDOs.
802.11b/g/n Wireless LAN Daughter board V2.1 4. REFERENCE DOCUMENTS C.I.S.P.R. Pub. 22 "Limits and methods of measurement of radio interference characteristics of information technology equipment." International Special Committee on Radio Interference (C.I.S.P.R.), Third Edition, 1997. CB Bulletin No. 96A "Adherence to IEC Standards: “Requirements for IEC 950, 2nd Edition and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product Categories: Meas, Med, Off, Tron.
02.11b/g/n Wireless LAN Daughter board V2.1 5. TECHNICAL SPECIFICATIONS 5.1 ABSOLUTE MAXIMUM RATING Supply Power Non Operating Temperature Voltage ripple Max +3.6 Volt - 40° to 85° Celsius +/- 2% Max. Values not exceeding Operating voltage 5.2 RECOMMENDABLE OPERATION CONDITION 5.2.
802.11b/g/n Wireless LAN Daughter board V2.1 5.3 WIRELESS SPECIFICATIONS The WM-N-BM-02_D-REF1 complies with the following features and standards on USI EVB: Features Description WLAN Standards IEEE 802 Part 11b/g/n (802.11b/g/n) Frequency Channel Band Channel 1 (2.412GHz) – Channel 14 (2.484GHz ) +/- 2dB Tolerance of Power Setting Standard Power Setting IEEE 802 Part 11b 12dBm Tx Power IEEE 802 Part 11g 10dBm IEEE 802 Part 11n 10dBm 5.4 RADIO SPECIFICATIONS Features Description Frequency Band 2.412GHz – 2.
802.11b/g/n Wireless LAN Daughter board V2.1 5.5 ANTNENNA PARAMETER (REFERENCE ONLY) Normal Impedance Operating Frequency 1 Radiated Efficiency 1,2 Peak Gain 50 Channel 1 (2.412 GHz) – Channel 14 (2.484 GHz ) Up to 55 -3 ≦ Peak ≦ 3.8 Ohms Hz % dBi Y Gain pattern position Z X Gain pattern 1 1 S11 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 10 .
802.11b/g/n Wireless LAN Daughter board V2.1 VSWR 1 1 For reference only. Peak gain measured with 0dBm reference input. 2 5.6 THROUGHPUT CONDITION REFERENCE (REFERENCE ONLY) Data Rate IEEE 802 Part 11n MCS7 1. Notebook ( Dual Core 2GHz) 2. Access Point (Ralink RT3883) 3. Another Notebook with SDIO Interface 4. WM-N-BM-02_D EVB 1.0 5. With 50 meter distance 1. Ubuntu 12.10 2. BCM43362 Driver (Version:1.88.10) 3. Firmware Version:5.90.195.89.5 4. Iperf 2.0.5 5. EndPoint Iperf 2.0.
802.11b/g/n Wireless LAN Daughter board V2.1 5.7 REFERENCE EVB CIRCUIT All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 12 .
802.11b/g/n Wireless LAN Daughter board V2.1 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 13 .
802.11b/g/n Wireless LAN Daughter board V2.1 5.8 TIMING DIAGRAM OF INTEFACE WIFI BOOT-UP Sequence WLAN_RESETB WIFI BOOT-UP Sequence All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 14 .
802.11b/g/n Wireless LAN Daughter board V2.1 SDIO TIMING SDIO timing in default mode SDIO Bus Timing Parameters (Default Mode) All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 15 .
802.11b/g/n Wireless LAN Daughter board V2.1 SDIO timing in High-Speed Mode SDIO Bus Timing Parameters (High-Speed Mode) All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 16 .
802.11b/g/n Wireless LAN Daughter board V2.1 GSPI Timing Parameter Clock period Symbol Minimum Maximum - Units Note T1 20.8 Clock high/low T2/T3 (0.45xT1) T4 ns Clock rise/fall time T4/T5 - 2.5 ns Input setup time T6 5 - ns Input hold time T7 5 - ns Output setup time T8 5 - ns Output hold time T9 5 - ns CSX to clocka - 7.86 - ns CSX fall to 1st rising edge Clock to CSXa - - - ns Last falling edge to CSX high (0.
802.11b/g/n Wireless LAN Daughter board V2.1 5.9 DIMENSIONS, WEIGHT AND MOUNTING The following paragraphs provide the requirements for the size, weight and mounting of the WM-N-BM-02_D-REF1. 5.9.1 DIMENSIONS The size and thickness of the WM-N-BM-02_D-REF1 is “10 mm (W) x 16.5 mm (L) x 1.8 mm (Max)(H). Module layout placement 6. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS The WM-N-BM-02_D-REF1 is pre-tested to ensure that all requirements met as set forth in the following sections.
802.11b/g/n Wireless LAN Daughter board V2.1 7. PIN OUT AND PIN DESCRIPTION Top View Pin Description Pin# 1 2 3 4 5 6 7 8 9 to 14 15 16 Pin Name WLAN_RESETB VDDIO SDIO D0 SDIO CLK SDIO D1 SDIO CMD SDIO D3 SDIO D2 GND VBAT VBAT Type Signal Power Signal Signal Signal Signal Signal Signal Power Power Power Refer 3.3V GND 3.3V 3.3V Description Active low WLAN reset signal Digital I/O supply SDIO data 0. SDIO clock. SDIO data 1. SDIO data CMD. SDIO data 3. SDIO data 2.
802.11b/g/n Wireless LAN Daughter board V2.1 8. REFLOW PROFILE GUIDELINE The reflow profile is dependent on many factors including flux selection, solder composition and the capability of user's reflow equipment. USI does not request a specific reflow profile but provides the following general guidelines: The solder composition typically sets the peak temperatures of the profile. Recommend lead free solder pastes SAC305: Type 4, water soluble or no clean are acceptable.
802.11b/g/n Wireless LAN Daughter board V2.1 RECOMMENDED REFLOW PROFILE (1) Solder paste alloy : SAC305 (Sn96.5/Ag3.0/Cu0.5) ( Lead Free solder paste.) (2) A-B. Temp.: 150~200℃; soak time:60~120sec.(Base on Flux type, reference only) (3) C. Peak temp: <245℃ (4) D. Time above 217 ℃: 40~90sec.(Base on SAC305) (5) Suggestion: Optimal cooling rate is <1℃/sec. from peak to 217 ℃. (6) Nine heater zones at least for Reflow equipment.
802.11b/g/n Wireless LAN Daughter board V2.1 9. PACKAGE AND STORAGE CONDITION 9.1 PACKAGE DIMENSION (Reference only) 9.2 EMC/ESD LEVEL (Reference only) According to FCC and CE standard Surface Resistivity: Interior:109~1011Ω/SQUARE EXTERIOR:108~1012Ω/SQUARE Dimension:475*420mm Tolerance:+5,0mm Color: Background : Gray Text : Red All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 22 .
802.11b/g/n Wireless LAN Daughter board V2.1 9.3 MSL Level/Storage condition (Reference only) All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI 23 .
802.11b/g/n Wireless LAN Daughter board V2.1 9.4 Recommended MSD baking Specification (Reference only) If the MSD control over the MSD Level standard ( MSD level standard refer IPC/ JEDEC ), please reference below request to make baking. 種類 Kind 須烘烤條件 烘烤條件 Need to baking status Baking specification.
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本產品符合低功率電波輻射性電機管理辦法： 第十二條 經形式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自 變更頻率、加大功率或變更原設計之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時， 應立即停用，並改善至無干擾時方的繼續使用。 前項合法通信，指依電信規定作業之無線電信。低功率射頻電機須忍受合法通信 或工業、科學及醫療用電波輻射性電機設備之干擾。
