Data Sheet

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RED bean

Data sheet

Quick specs

• 802.11a/b/g/n/ac, 2.4 and 5 GHz, 1x1 SISO, 433 Mbps

data rate, up to 20 dBm output power

• 20/40/80 MHz channel size support

• STBC, MU-MIMO, transmit beam-forming

• Bluetooth v5.0, BLE, ANT+ and backwards compatibility

with BT v1.x and BT v2.x + enhanced data rate

• Connectorized (Murata HSC type connector: MM4829-

2702RB0) or an integrated dual-band antenna version

• Linux, Windows and Android drivers available

• Based on QCA9377-3 chipset

• Industrial temperature range -40 to +85 C°

• Very small form factor (17 by 12 mm without antenna or

24 by 12 mm with antenna)

• Surface mount, dual-side design

• Available interfaces - Bluetooth UART, WLAN SDIO 3.0

RED bean is a high performance and ultra low power

surface mount SDIO radio combining single-stream

11ac Wave2 Wi-Fi and Bluetooth® 5.0 in a very small form factor

RED bean is IEEE 802.11b/g/n/a/ac Wave2 dual-band

wireless LAN and Bluetooth 5.0 SDIO 3.0 module

optimised for small size and low power consumption.

It is based on Qualcomm QCA9377-3 chipset. Has an

integrated dual-band (2.4 and 5 GHz) 1x1 802.11ac

Wave2 WiFi (supporting MU-MIMO) and Bluetooth®

5.0 transceivers and combined in to very small form

factor (17 x 12 mm with RF connector and 24 x

12mm with integrated antenna).

The radio module supports advanced power saving

techniques. Bluetooth supports both Class1 and

Class2 transmissions and advanced coexistence

mechanisms allow it to work seamlessly with Wi-Fi

ensuring good quality and high performance.

RED bean software drivers are available for Linux,

Windows 10 and Android operating systems.

Summary of content (11 pages)

PAGE 1
RED bean Data sheet RED bean is a high performance and ultra low power surface mount SDIO radio combining single-stream 11ac Wave2 Wi-Fi and Bluetooth® 5.0 in a very small form factor RED bean is IEEE 802.11b/g/n/a/ac Wave2 dual-band wireless LAN and Bluetooth 5.0 SDIO 3.0 module optimised for small size and low power consumption. It is based on Qualcomm QCA9377-3 chipset. Has an integrated dual-band (2.4 and 5 GHz) 1x1 802.11ac Wave2 WiFi (supporting MU-MIMO) and Bluetooth® 5.
PAGE 2
Block diagram +3.3V WLAN SDIO 3.0 BT UART QCA9377-3 CHIPSET DIPLEXER WLAN & BT ANT ANTENNA RED bean MODULE Module dimensions (with antenna/ without antenna) RED bean Data sheet v1.
PAGE 3
Radio characteristics 2.4 GHz 802.11AC (20 MHz) 2.4 GHz 802.11AC (40 MHz) 5 GHz 802.11AC (20 MHz) 5 GHz 802.11AC (40 MHz) 5 GHz 802.11AC (80 MHz) Data rate (Mbps) 7.2 14.4 21.7 28.9 43.3 57.8 65 72.2 86.
PAGE 4
Pinout Information (with antenna/ without antenna) RED bean HCI_UART_RTS 1 23 GND HCI_UART_CTS 2 22 WLAN_RFKILL_L N.C. 18 GND 7 17 SDIO_INT_L SDIO_DATA2 8 16 SDIO_DATA1 SDIO_DATA3 9 15 SDIO_DATA0 GND 14 6 BT_EN SDIO_CLK WL_EN 13 HCI_UART_WAKEHOST_L 12 19 VDD33 5 11 N.C. GND GND 20 VDD_SDIO 21 4 10 3 SDIO_CMD HCI_UART_TX HCI_UART_RX HCI_UART_RTS 1 23 HCI_UART_CTS 2 22 WLAN_RFKILL_L HCI_UART_TX 3 21 N.C. HCI_UART_RX 4 20 N.C.
PAGE 5
Pin Name I/O Description 1 HCI_UART_RTS DO UART RTS signal 2 HCI_UART_CTS DI UART CTS signal 3 HCI_UART_TX DO UART TX signal 4 HCI_UART_RX DI UART RX signal 5 GND - Ground connection 6 WL_EN PU WLAN enable. Active high 7 BT_EN PU Bluetooth enable. Active high 8 SDIO_DATA2 B SDIO data bus D2 9 SDIO_DATA3 B SDIO data bus D3 10 SDIO_CMD DI SDIO CMD line signal 11 VDD_SDIO PI Voltage supply input 1.8V or 3.
PAGE 6
PCB footprint (same for RED bean C and RED bean A modules) 3.05 4.65 9.35 9.45 12.5 1.6 4.28 10.8 12.8 15.55 2.8 Cut 1.15 2.5 Detail A A R0 .3 R1 2.5 1.9 3 R0 .2 B 5 R 0. 3 Detail B 1.15 1.4 Soldering paste footprint (same for RED bean C and RED bean A modules) Development kit 2 1 - SDIO interface (micro SD) 4 1 2, 3 - Module breakout for accessing HCI UART and other functionality 4 - RED bean module 3 RED bean Data sheet v1.
PAGE 7
Reflow profile recommendation Ramp up rate Maximum time maintained above 217°C Peak temperature Maximum time within 5°C of peak temperature Ramp down rate 3°C/second max 120 seconds 250°C 20 seconds 6°C/second max Reflow profile Temperature, C 250 200 150 100 50 0 Time Ordering part number RED-BEAN-C RED bean with connector for external antenna RED-BEAN-A RED bean with an integrated dual-band ceramic omni-directional antenna RED-BEAN-DVK RED bean Data sheet v1.
PAGE 8
Packaging RED bean modules are packed into vacuum sealed trays. A tray of RED-BEAN-A fits 60 modules and a tray of REDBEAN-C fits 78 modules. Every 5 trays are vacuum sealed packaging 300 of RED-BEAN-A modules or 390 of RED-BEAN-C modules. RED-BEAN-A tray 310 Slot CL Slot CL Slot CL 130 Slot CL 93 18.6 Slot CL Slot CL 9 29.8 268.2 RED-BEAN-C tray 310 Slot CL Slot CL Slot CL 130 Slot CL 94.5 18.9 Slot CL 22.5 270 RED bean Data sheet v1.
PAGE 9
Antenna info 1. Type:External antenna Gain:2.4G :4.0 dBi 5G: 4.5 dBi Manufacturer:RF Solutions Ltd 2. Type:External antenna Gain:2.4G :3.2 dBi 5G: 4.25 dBi Manufacturer:molex 3. Type: Ceramic Antenna Gain:2.4G :3.0 dBi 5G: 3.0 dBi Manufacturer:TDK FCC Statement This device complies with part 15 of the FCC Rules.
PAGE 10
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver.
PAGE 11
(1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device Cet appareil contient des émetteurs / récepteurs exemptés de licence conformes aux RSS (RSS) d'Innovation, Sciences et Développement économique Canada. Le fonctionnement est soumis aux deux conditions suivantes : (1) Cet appareil ne doit pas causer d'interférences.